DRAGON GROUP INTL LIMITED (MT1) SGD 0.004   +0.00% +0.00

Dividend Yield(TTM) = 0.00%

If you find any of the dividend record is wrong or duplicated, please contact me.

Year Yield Total Amount Ex Date Pay Date Particulars
20100.00%SGD 0 - 2010-12-13 - SHARE CONSO OFFER OF 1 FOR 4
- 2010-11-11 - 4RS4WTS FOR 1SH OFFER OF 4 FOR 1 @ SGD 0.02
2007250.00%SGD 0.01 SGD0.01 2007-08-23 2007-09-12 FRANKED SGD 0.01 NET OF TAX
2001125.00%SGD 0.005 SGD0.005 2001-06-05 2001-06-20 SGD 0.005 LESS TAX
2000125.00%SGD 0.005 SGD0.005 2000-06-26 2000-07-20 SGD 0.005 LESS TAX
1999100.00%SGD 0.004 SGD0.004 1999-07-06 1999-07-23 SGD 0.004 LESS TAX
19980.00%SGD 0 SGD0.004 1998-07-03 1998-07-23 (SGD) 0.4 CENTS LESS TAX
- 1998-06-02 - OFFER OF 1 FOR 5
19970.00%SGD 0 - 1997-09-26 - 2.5LS+3WFOR10SH OFFER OF 25 FOR 100 @ SGD 1
SGD0.0035 1997-07-03 1997-07-23 (SGD) 0.35 CENTS LESS TAX
19960.00%SGD 0 - 1996-06-11 1996-07-03 SP BONUS DIV (SGD) 0.5 CENTS LESS TAX
SGD0.005 1996-06-11 1996-07-03 SP BONUS DIV (S$) 0.5 CENTS LESS TAX
SGD0.0025 1996-06-11 1996-07-03 (SGD) 0.25 CENTS LESS TAX
19950.00%SGD 0 SGD0.0025 1995-06-09 1995-06-30 0.25 CENTS LESS TAX

DRAGON GROUP INTL LIMITED

http://www.dragongp.com

ListedDate: 7 September 1994 on SGX Sesdaq 22 September 1998 on SGX Mainboard

The share price is in SGD. The dividends are paid in SGD

Address: 1 Robinson Road , #18-00 AIA Tower, Singapore 048542

In 1990, the Chairman and his associates incorporated various companies in the Group to carry on the business of industrial distribution and tape and reel manufacturing services for surface mount technology for electronic components. Today, it is a component supplier and distributor to certain key sectors of the electronic industry such as computer disk drives, telecommunications and consumer electronics. Flextech Hldgs was incorporated on 13 October 1993 as a private limited company. It was converted into a public company on 18 August 1994. The principal activities of the Company are those of investment holding. The subsidiaries are primarily engaged in the sale and distribution of electronic components and acting as commission agents; assembly services and manufacturing of electronic products; including switches, repackaging of electronic components; and developing and marketing equipment in semiconductor back-end processes and the design and manufacture of probe cards and packing materials for electronic devices.


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