STATS CHIPPAC LTD (S24) USD 0.46
Dividend Yield(TTM) =
If you find any of the dividend record is wrong or duplicated, please contact me.
STATS ChipPAC Ltd., together with its subsidiaries, provides semiconductor packaging design, bump, probe, assembly, test, and distribution services for communications, digital consumer, and computing market applications. Its services include post wafer fab process, and back-end assembly and test. The company offers wafer bumping for both 200mm and 300mm wafer sizes in a range of options, including printed bump, ball drop, and plated technology with eutectic, high lead, lead free, and copper column alloys. The companys wafer bumping offering includes wafer bump and redistribution, turnkey services for advanced flip chip applications, and turnkey services for wafer level chip scale packages. The companys packaging services support various package technologies, including wafer level products; flip chip packages; copper wirebond packages; ball grid array and fine pitch ball grid array packages; quad flat no-lead and bump chip carrier packages; quad flat pack and thin small outline packages; system-in-package; 3D packages; and memory cards. It also provides a suite of solutions and test platforms comprising test facilities, test platforms, wafer sort, test development services, RF test, mixed signal test, memory test, high-end digital test, strip test, final test, and post test solutions, as well as integrated test management system. In addition, it provides warehousing, drop shipment, administration, and research services. The company markets its services through direct sales force in the United States, South Korea, Japan, China, Singapore, Malaysia, Taiwan, and Switzerland. STATS ChipPAC Ltd. was founded in 1994 and is headquartered in Singapore. STATS ChipPAC Ltd. operates as a subsidiary of Singapore Technologies Semiconductors Pte Ltd.