Hi-P Dividend Yield (H17)

HI-P INTERNATIONAL LIMITED (H17) SGD 1.99 +0.00% +0.00

TTM Dividend Yield: 0.00%

Year	Yield	Total	Amount	Ex Date	Pay Date	Particulars

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Hi-P International Limited operates as a vertically integrated contract manufacturer serving the wireless telecommunications, consumer electronics and computing, and automotive industries. It operates through three segments: Precision Plastic Injection Molding; Mold Design and Fabrication; and Provision of Sub-Product Assembly and Full-Product Assembly Services. The company offers industrial and product design, manufacture, and assembly services; and ancillary value-added services, such as surface decoration finishing and precision metal stamping. It is also involved in the manufacture and sale of molds and special tools, related housing appliance plastic components and equipment, and water treatment equipment; plastic components and plastic product modules; mold base and components; electric components and electronic communication equipment; trays; in-mold decoration lenses; metal precision components; and metal and non-metal stampings, as well as provision of spray painting, engineering support, maintenance, and technology consultation services. In addition, the company is engaged in the design, development, and manufacture of automated machinery and equipment; purchase and sale of tools, molds, plastic and metal components, equipment, commodities, and scrap material; design and fabrication of dies; and manufacture, SMT, assembly, and trade of flexible printed circuit boards and flexible rigid printed circuit boards. It has operations primarily in the People's Republic of China, Poland, Singapore, Thailand, Taiwan, Europe, the United States, and the rest of Americas. The company was founded in 1980 and is headquartered in Singapore.