ADVANCED SYSTEMS AUTOMATION (5TY) SGD 0.001   +0.00% +0.00

Dividend Yield(TTM) = 0.00%

If you find any of the dividend record is wrong or duplicated, please contact me.

Year Yield Total Amount Ex Date Pay Date Particulars
20170.00%SGD 0 - 2017-05-17 - OFFER OF 5 FOR 1 @ SGD 0.0009
20120.00%SGD 0 - 2012-04-19 - OFFER OF 11 FOR 1 @ SGD 0.025
- 2012-04-05 - SHARE CONSOL OFFER OF 1 FOR 15
20060.00%SGD 0 - 2006-07-25 - OFFER OF 5 FOR 2 @ SGD 0.01
20010.00%SGD 0 SGD0.1 2001-09-04 2001-09-21 10% TAX EXEMPT
20000.00%SGD 0 SGD0.1 2000-10-05 2000-10-20 10% TAX EXEMPT
19990.00%SGD 0 SGD0.1 1999-09-28 1999-10-12 10% TAX EXEMPT
19980.00%SGD 0 SGD0.15 1998-09-22 1998-10-13 15% TAX EXEMPT
19970.00%SGD 0 SGD0.15 1997-09-09 1997-09-29 15% TAX EXEMPT

ADVANCED SYSTEMS AUTOMATION

http://www.asa.com.sg/

ListedDate: 22 July 1996 on SGX Sesdaq

The share price is in SGD. The dividends are paid in SGD

Address: 33 Ubi Avenue 3 #08-693 , Vertex, Singapore 408868

The ASA Group of Companies started in 1978 as a precision engineering company manufacturing semiconductor tools and spares. Since then, the Group has strategically molded its core business towards manufacturing automation equipment for the encapsulation of semiconductors. ASA’s equipment is used in IC manufacturing processes. It also supplies machines for the back-end assembly of ICs. Today, the Group is an international manufacturer of automated backend equipment for the semiconductor assembly process. Its equipment are sold worldwide to major semiconductor manufacturers such as ST Microelectronics Group, Kemet Electronics Portugal, S.A., Global Advanced Packaging Technology, Carsem Group and Cypress Manufacturing Limited. To enhance ASA’s position in the Flip-chip arena, Advanpack Solutions Pte Ltd was formed in January 1997 to acquire infrastructure capabilities critical for the packaging shift from wirebonded package to Flip-chip. Today, the ASA Group has the capability to provide a comprehensive Flipchip solution combining APS’s technology, processes and material such as Pillar Bumping and No-Flow Underfill with ASA’s equipment.


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