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  2. IS (HK) INV US$295M2.9%B221230 (SGX: WEDB) Announcements

IS IS (HK) INV US$295M2.9%B221230 WEDB

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30 Dec 2019

US$295,000,000 2.9% Credit Enhanced Bonds due 2022

Debt - Listing Confirmation
Filing viewer · member access Original SGX announcement
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